Invention Grant
- Patent Title: Compact system with memory and PMU integration
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Application No.: US15430747Application Date: 2017-02-13
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Publication No.: US10311938B2Publication Date: 2019-06-04
- Inventor: Sanjay Dabral
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
- Agent Lawrence J. Merkel
- Main IPC: G11C11/4074
- IPC: G11C11/4074 ; G11C14/00 ; H01L23/64 ; H01L25/065 ; H01L23/498 ; H01L23/522 ; G11C7/02 ; G11C5/14 ; G11C29/02 ; H01L23/00 ; H01L25/18

Abstract:
One or more integrated circuits including at least one integrated circuit that is fabricated in a DRAM fabrication process. Capacitors in the DRAM-fabricated integrated circuit can be used for decoupling for logic components of the integrated circuits, and may be used for fine-grain on-chip PMUs. Embedded DRAM memories can be used instead of SRAM memories, with increased density and reduced leakage. More compact systems can be implemented using the integrated circuits.
Public/Granted literature
- US20170154664A1 Compact System with Memory and PMU Integration Public/Granted day:2017-06-01
Information query
IPC分类: