Invention Grant
- Patent Title: Photosensitive reducible silver ion-containing compositions
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Application No.: US15231847Application Date: 2016-08-09
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Publication No.: US10311990B2Publication Date: 2019-06-04
- Inventor: Deepak Shukla
- Applicant: Eastman Kodak Company
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent J. Lanny Tucker
- Main IPC: H01B1/02
- IPC: H01B1/02 ; G03F7/06

Abstract:
A photosensitive reducible silver ion-containing composition can be used to provide electrically-conductive silver metal in thin film or patterns on a substrate after irradiation with UV-visible light. The composition comprises: a) a non-hydroxylic-solvent soluble silver complex represented by the following formula (I): wherein L represents an α-oxy carboxylate; P represents a primary alkylamine; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is b, b is 1, and when a is 2, b is 2; b) optionally, a photosensitizer that can either reduce the reducible silver ion or oxidize the α-oxy carboxylate; and c) a solvent medium comprising at least one non-hydroxylic solvent.
Public/Granted literature
- US20180047477A1 PHOTOSENSITIVE REDUCIBLE SILVER ION-CONTAINING COMPOSITIONS Public/Granted day:2018-02-15
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