Invention Grant
- Patent Title: Circuit board with thermal paths for thermistor
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Application No.: US15388322Application Date: 2016-12-22
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Publication No.: US10312003B2Publication Date: 2019-06-04
- Inventor: BongGeun Chung , YoonJoo You
- Applicant: FAIRCHILD KOREA SEMICONDUCTOR LTD.
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Dickinson Wright PLLC
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01C7/04 ; H05K1/18 ; H01R12/58 ; H05K3/34

Abstract:
A circuit board for an electronic device includes pattern areas on both sides of the circuit board. Each end of a thermistor is electrically connected to electrically conductive pads on pattern areas on the top and bottom sides of the circuit board. An input plug is electrically connected to an end of the thermistor. The input plug is electrically connected to the thermistor by way of an input connector to which the circuit board is inserted.
Public/Granted literature
- US20170207008A1 CIRCUIT BOARD WITH THERMAL PATHS FOR THERMISTOR Public/Granted day:2017-07-20
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