Invention Grant
- Patent Title: Ring member with air holes and substrate processing system including the same
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Application No.: US15255626Application Date: 2016-09-02
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Publication No.: US10312059B2Publication Date: 2019-06-04
- Inventor: Chulkyun Seok , Taekyun Kang , JungHwan Um , Changwon Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2015-0125718 20150904
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01J37/32
Abstract:
A substrate processing system includes a wall liner, an electrostatic chuck in the wall liner to hold a substrate, and a ring member including a focus ring and a side ring. The focus ring is on an edge region of the electrostatic chuck and the side ring encloses an outer side surface of the focus ring and a side surface of the electrostatic chuck. The side ring includes air holes extending from a bottom surface of the ring member towards a top portion of the ring member and extending from the top portion of the ring member towards an outer side surface of the ring member.
Public/Granted literature
- US20170069471A1 RING MEMBER WITH AIR HOLES AND SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME Public/Granted day:2017-03-09
Information query
IPC分类:
