Invention Grant
- Patent Title: Structure for FinFET devices
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Application No.: US16045576Application Date: 2018-07-25
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Publication No.: US10312072B2Publication Date: 2019-06-04
- Inventor: Jin Cai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01G4/018
- IPC: H01G4/018 ; H01L21/02 ; H01L33/00 ; H01L27/088 ; H01L29/02

Abstract:
A semiconductor device and a method of forming the same are disclosed. The semiconductor device includes a semiconductor substrate; a fin extending from the semiconductor substrate; a first charged dielectric layer covering a bottom portion of the fin, the first charged dielectric layer having net fixed first-type charges; a second charged dielectric layer covering the first charged dielectric layer, the second charged dielectric layer having net fixed second-type charges, the second-type charges being opposite to the first-type charges; and a gate structure engaging a top portion of the fin.
Public/Granted literature
- US20180350586A1 Method and Structure for FinFET Devices Public/Granted day:2018-12-06
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