Invention Grant
- Patent Title: Method for forming aluminum-containing dielectric layer
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Application No.: US14878016Application Date: 2015-10-08
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Publication No.: US10312077B2Publication Date: 2019-06-04
- Inventor: Peter Ramvall
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/40 ; C23C16/455

Abstract:
The present disclosure provides a method of forming an aluminum-containing layer. The method includes providing a substrate in an atomic layer deposition (ALD) process chamber; and performing a cycle of a first step and a second step one or more times in the ALD process chamber to provide a composite layer, wherein performing the first step of the cycle includes: applying a first precursor that includes a non-aluminum-based component having a first molecular weight onto the substrate; and applying a second precursor that that includes an aluminum-based component having a second molecular weight onto the substrate, wherein the second molecular weight is lower than the first molecular weight; and wherein performing the second step of the cycle includes applying the first precursor onto the substrate.
Public/Granted literature
- US20170103883A1 Method for Forming Aluminum-Containing Dielectric Layer Public/Granted day:2017-04-13
Information query
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