Invention Grant
- Patent Title: Multi-layer work function metal gates with similar gate thickness to achieve multi-VT for VFETs
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Application No.: US15958765Application Date: 2018-04-20
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Publication No.: US10312147B2Publication Date: 2019-06-04
- Inventor: Ruqiang Bao , Hemanth Jagannathan , Paul C. Jamison , ChoongHyun Lee
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L21/82
- IPC: H01L21/82 ; H01L21/8234 ; H01L27/088 ; H01L27/092 ; H01L21/8238 ; H01L29/49 ; H01L29/66

Abstract:
A method is presented for forming a device having multiple field effect transistors (FETs) with each FET having a different work function. In particular, the method includes forming multiple microchips in which each FET has a different threshold voltage (Vt) or work-function. In one embodiment, four FETs are formed over a semiconductor substrate. Each FET has a source, drain and a gate electrode. Each gate electrode is processed independently to provide a substantially different threshold voltage.
Public/Granted literature
- US20180294192A1 MULTI-LAYER WORK FUNCTION METAL GATES WITH SIMILAR GATE THICKNESS TO ACHIEVE MULTI-VT FOR VFETS Public/Granted day:2018-10-11
Information query
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