Invention Grant
- Patent Title: Inspection system and inspection method
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Application No.: US15547858Application Date: 2016-01-08
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Publication No.: US10312166B2Publication Date: 2019-06-04
- Inventor: Shinsuke Suzuki , Hirotoshi Terada , Shunsuke Matsuda
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2015-024409 20150210
- International Application: PCT/JP2016/050517 WO 20160108
- International Announcement: WO2016/129305 WO 20160818
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/66 ; B23K26/70 ; B23K26/362 ; G06T7/00 ; H01L21/67 ; B23K26/00 ; B23K26/03 ; B23K26/402 ; B23K26/359 ; B23K26/364 ; B23K26/352 ; G02B5/20 ; B23K101/42 ; B23K103/10 ; B23K103/16

Abstract:
An inspection system includes a laser light source, an optical system for laser marking that irradiates a semiconductor device with laser light from a metal layer side, a control unit that controls the laser light source to control laser marking, a two-dimensional camera that detects light from the semiconductor device on a substrate side and outputs an optical reflection image, and an analysis unit that generates a pattern image of the semiconductor device, and the control unit controls the laser light source so that laser marking is performed until a mark image appears in a pattern image.
Public/Granted literature
- US20180033704A1 INSPECTION SYSTEM AND INSPECTION METHOD Public/Granted day:2018-02-01
Information query
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