A fan-out semiconductor package includes a semiconductor chip having an active surface, the active surface having a connection pad disposed thereon, and an inactive surface opposing the active surface; an encapsulant encapsulating at least a portion of the semiconductor chip; an insulating layer disposed on the active surface of the semiconductor chip; and a redistribution layer disposed on the insulating layer and electrically connected to the connection pad. The insulating layer includes a low tan delta (Df) dielectric material.