Invention Grant
- Patent Title: Array substrate
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Application No.: US15839870Application Date: 2017-12-13
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Publication No.: US10312206B2Publication Date: 2019-06-04
- Inventor: Jia-Hong Ye , Pin-Fan Wang
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW106131079A 20170911
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L27/32 ; H01L27/12
Abstract:
An array substrate includes a device array, a bonding pad, and at least one support structure. The bonding pad is located in a bonding area and is electrically connected to the device array. A horizontal distance between the at least one support structure and the bonding pad is between 5 μm and 1000 μm.
Public/Granted literature
- US20190081124A1 ARRAY SUBSTRATE Public/Granted day:2019-03-14
Information query
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