Invention Grant
- Patent Title: Electrode assembly and method for manufacturing same
-
Application No.: US15445549Application Date: 2017-02-28
-
Publication No.: US10312215B2Publication Date: 2019-06-04
- Inventor: Yong Hee Kim , Sang Don Jung
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTIT
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTIT
- Current Assignee Address: KR Daejeon
- Priority: KR10-2016-0024374 20160229
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L21/263 ; H01L21/768 ; A61B5/00 ; A61N1/05 ; A61N1/04
Abstract:
Provided is an electrode assembly which may be manufactured by providing a first substrate and a second substrate, plasma treating the first substrate, forming an electrode on the first substrate, and thermally compressing the first substrate and the second substrate, with the electrode therebetween, wherein each of the first substrate and the second substrate includes a fluorine-based polymer.
Public/Granted literature
- US20170250157A1 ELECTRODE ASSEMBLY AND METHOD FOR MANUFACTURING SAME Public/Granted day:2017-08-31
Information query
IPC分类:
