Invention Grant
- Patent Title: Method of forming fin shape structure having different buffer layers
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Application No.: US15892366Application Date: 2018-02-08
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Publication No.: US10312235B2Publication Date: 2019-06-04
- Inventor: Wen-Yin Weng , Cheng-Tung Huang , Wei-Heng Hsu , Yu-Ming Lin , Ya-Ru Yang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/762 ; H01L21/8234 ; H01L21/8238 ; H01L21/8258 ; H01L27/088 ; H01L27/092 ; H01L29/165 ; H01L29/205 ; H01L29/06 ; H01L29/66 ; H01L29/78

Abstract:
A fin shaped structure and a method of forming the same. The method includes providing a substrate having a first fin structure and a second fin structure. Next, an insulation material layer is formed on the substrate. Then, a portion of the first fin structure is removed, to form a first recess. Following this, a first buffer layer and a first channel layer are formed sequentially in the first recess. Next, a portion of the second fin structure is removed, to form a second recess. Then, a second buffer layer and a second channel layer are formed in the second recess sequentially, wherein the second buffer layer is different from the first buffer layer.
Public/Granted literature
- US20180166444A1 METHOD OF FORMING FIN SHAPE STRUCTURE Public/Granted day:2018-06-14
Information query
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