A method of manufacturing an array substrate assembly and an array substrate assembly manufactured by the method are disclosed. The method includes: manufacturing a gate metal layer on a substrate, the gate metal layer including a gate line and a common electrode signal line spaced from each other; forming a gate insulating layer, an active layer, a source-drain electrode layer, a passivation layer, and a protective pattern on the gate metal layer; and forming, in the passivation layer and the gate insulating layer, a via hole configured for a connection to the common electrode signal line. An orthogonal projection of the protective pattern on the substrate and an orthogonal projection of the via hole on the substrate partly coincide with each other, and the orthogonal projection of the protective pattern on the substrate and an orthogonal projection of the gate line on the substrate partly coincide with each other.