A solid-state imaging device includes a first substrate, a second substrate, an electrode portion, a first substrate connecting portion, an electrostatic protection circuit, and a second substrate connecting portion. A photoelectric conversion element is disposed on the first substrate. A part of the peripheral circuit is arranged on the second substrate. The electrode portion has a connection surface. The first substrate connecting portion electrically connects the electrode portion and the second substrate. The electrostatic protection circuit is connected to a circuit between the first substrate connecting portion and the peripheral circuit. The second substrate connecting portion electrically connects the peripheral circuit and the photoelectric conversion element. The electrostatic protection circuit is disposed at a position such that the electrostatic protection circuit does not overlap any of the first substrate connecting portion and the second substrate connecting portion.