- Patent Title: Semiconductor device and semiconductor device manufacturing method
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Application No.: US15961919Application Date: 2018-04-25
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Publication No.: US10312284B2Publication Date: 2019-06-04
- Inventor: Hiroki Kasai
- Applicant: LAPIS Semiconductor Co., Ltd.
- Applicant Address: JP Yokohama
- Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee Address: JP Yokohama
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: JP2015-187014 20150924
- Main IPC: H01L31/119
- IPC: H01L31/119 ; H01L27/146 ; G01T1/24 ; H01L31/02 ; H01L31/0224 ; H01L31/08

Abstract:
A semiconductor device including a first semiconductor layer including a first region and a second region adjacent to the first region; a first insulator layer provided above the first semiconductor layer; an intermediate semiconductor layer, having an n-type conduction, provided above the first region of the first semiconductor layer and above the first insulator layer; a second insulator layer provided above the intermediate semiconductor layer; a second semiconductor layer provided above the first region of the first semiconductor layer and above the second insulator layer; a sensor formed in the second region of the first semiconductor layer; a contact electrode connected to the intermediate semiconductor layer; and a circuit element formed in the second semiconductor layer.
Public/Granted literature
- US20180240841A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD Public/Granted day:2018-08-23
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