A semiconductor apparatus may include a first circuit forming region formed over a substrate, a first interlayer dielectric layer formed over the first circuit forming region, a first metal layer formed over the first interlayer dielectric layer, a second interlayer dielectric layer formed over the first metal layer, and a second circuit forming region formed over the second interlayer dielectric layer. A first circuit and a second circuit that are included in the first circuit forming region and a third circuit that is included in the second circuit forming region may be electrically coupled to each other.