Invention Grant
- Patent Title: Semiconductor device, manufacturing method of semiconductor device, power unit, and amplifier
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Application No.: US15652951Application Date: 2017-07-18
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Publication No.: US10312344B2Publication Date: 2019-06-04
- Inventor: Shirou Ozaki
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2016-190285 20160928
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/02 ; H01L21/306 ; H01L21/28 ; H01L29/205 ; H01L29/778 ; H01L29/417 ; H01L29/423 ; H01L29/20 ; H01L29/51

Abstract:
A semiconductor device includes a first semiconductor layer formed of a compound semiconductor, provided over a substrate; a second semiconductor layer formed of a compound semiconductor including In and Al, provided over the first semiconductor layer; source and drain electrodes provided on the second semiconductor layer; and a gate electrode provided between the source and drain electrodes, on the second semiconductor layer. The compound semiconductor in the second semiconductor layer has a first In composition ratio in a region on a side facing the substrate and a second In composition ratio in a region on an opposite side, the second In composition ratio being lower than the first In composition ratio, and the source and drain electrodes are provided in contact with the region having the first In composition ratio, and the gate electrode is provided on the region having the second In composition ratio.
Public/Granted literature
- US20180090595A1 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, POWER UNIT, AND AMPLIFIER Public/Granted day:2018-03-29
Information query
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