Invention Grant
- Patent Title: Flexible electronic assembly with semiconductor die
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Application No.: US15627215Application Date: 2017-06-19
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Publication No.: US10312415B2Publication Date: 2019-06-04
- Inventor: James David Holbery , Siyuan Ma , Benjamin Sullivan
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
- Current Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
- Current Assignee Address: US WA Redmond
- Agency: Alleman Hall Creasman & Tuttle LLP
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/50 ; H01L33/62 ; H01L33/00 ; H01L25/075 ; H05K3/28 ; H01L33/20 ; H05K1/03
Abstract:
An electronic assembly comprises a flexible polymer membrane having a surface with one or more electrically conductive traces arranged on the surface, a light-emissive semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive, and a flexible cover layer arranged over the surface of the polymer membrane and the semiconductor die.
Public/Granted literature
- US20180366619A1 FLEXIBLE ELECTRONIC ASSEMBLY WITH SEMICONDUCTOR DIE Public/Granted day:2018-12-20
Information query
IPC分类:
