Invention Grant
- Patent Title: CVD thin film stress control method for display application
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Application No.: US15613667Application Date: 2017-06-05
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Publication No.: US10312475B2Publication Date: 2019-06-04
- Inventor: Tae Kyung Won , Soo Young Choi , Sanjay D. Yadav , Carl A. Sorensen , Chien-Teh Kao , Suhail Anwar , Young Dong Lee
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L51/56 ; H01L51/52 ; H01L51/00

Abstract:
Embodiments of the present disclosure generally describe a method for depositing a barrier layer of SiN using a high density plasma chemical vapor deposition (HDP-CVD) process, and in particular, controlling a film stress of the deposited SiN layer by biasing the substrate during the deposition process.
Public/Granted literature
- US20180331328A1 CVD THIN FILM STRESS CONTROL METHOD FOR DISPLAY APPLICATION Public/Granted day:2018-11-15
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