A floating connector assembly device is provided. An electronic component is mounted directly or indirectly to a chassis of an electronic device. At least one conductive contact spring is mounted to the electronic component and configured to electrically couple to the electronic component. A printed circuit board having a fixed end and a free end with an electrical contact positioned between the two ends is positioned against the conductive contact spring, the contact spring being biased so that a contacting portion of the contact spring contacts the electrical contact to form an electrical connection. The electrical connection is maintained during relative movement of the conductive contact spring and the electrical contact of the printed circuit board by a bias force of the conductive contact spring.