A mounting assembly for electro-mechanically connecting an electrically-powered device to a structure includes a housing, a first printed circuit board, an adapter, and a second printed circuit board. The housing has a shape defining a front opening and a first mating structure. The first printed circuit board is located within the housing and has a first plurality of electrical contacts facing the front opening. The adapter is attachable to the device and has a second mating structure that removably engages with the first mating structure of the housing. The second printed circuit board is coupled with the adapter and has a second plurality of electrical contacts exposed on its back surface to electrically connect to the first plurality of electrical contacts when the first mating structure of the housing engages with the second mating structure of the adapter.