Invention Grant
- Patent Title: Layer one signaling for physical layer pipes (PLPS)
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Application No.: US15167140Application Date: 2016-05-27
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Publication No.: US10313492B2Publication Date: 2019-06-04
- Inventor: Young-ho Oh , Hak-ju Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2016-0036945 20160328
- Main IPC: H04L29/06
- IPC: H04L29/06 ; H04L29/08 ; H04L12/46 ; H04L1/00

Abstract:
A transmitting apparatus is provided. The transmitting apparatus includes at least one processor configured to implement: an L1 signaling generator configured to generate L1 signaling; a frame generator configured to generate a frame having a payload in which a plurality of Physical Layer Pipes (PLPs) are included; and a signal processor configured to transmit the frame by adding a preamble including the L1 signaling in the frame. The L1 signaling includes first information representing an alignment state of starting positions of PLPs included in different layers among the plurality of PLPs and second information representing at least one offset of the starting positions. Accordingly, the preamble includes the L1 signaling including information on an arrangement order of the plurality of PLPs included in the payload.
Public/Granted literature
- US20160352873A1 TRANSMITTING APPARATUS, RECEIVING APPARATUS, AND METHOD FOR CONTROLLING THE SAME Public/Granted day:2016-12-01
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