A circuit board, on which a packaged semiconductor integrated circuit is to be mounted, includes a substrate, a heat-dissipating connection pad, and a first open area. The substrate includes a substrate body having a main surface, a metal layer located on the main surface, and an insulating layer located on the metal layer. In the heat-dissipating connection pad, the metal layer is exposed from an opening in the insulating layer. The heat-dissipating connection pad is connectable to a heat-dissipating unit of the semiconductor integrated circuit via a bond. In the first open area, the metal layer is exposed from an opening in the insulating layer located outboard with respect to a periphery of the heat-dissipating connection pad.