Invention Grant
- Patent Title: Electric connection structure and electric connection member
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Application No.: US15613752Application Date: 2017-06-05
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Publication No.: US10314175B2Publication Date: 2019-06-04
- Inventor: Junya Sato , Ryosuke Mitsui
- Applicant: Japan Aviation Electronics Industry, Limited
- Applicant Address: JP Tokyo
- Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JP2015-036546 20150226
- Main IPC: H05K3/12
- IPC: H05K3/12 ; C09D11/38 ; C09D11/52 ; H01R4/02 ; H01R4/04 ; H01R4/70 ; H05K3/00 ; H05K3/38 ; H05K3/40 ; C09D11/037 ; C09D11/14 ; C09D11/322 ; H05K1/11 ; H05K3/32 ; H01R12/52

Abstract:
There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.
Public/Granted literature
- US20170273192A1 ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER Public/Granted day:2017-09-21
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