Invention Grant
- Patent Title: Component mounting machine
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Application No.: US15300095Application Date: 2014-03-28
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Publication No.: US10314218B2Publication Date: 2019-06-04
- Inventor: Shigeto Oyama , Jun Iisaka
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2014/059102 WO 20140328
- International Announcement: WO2015/145720 WO 20151001
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04 ; H05K13/08

Abstract:
A component mounting machine including: a nozzle that picks up a component; sliders and a ball screw that move the nozzle in horizontal and vertical directions; a reel unit that supplies components; a board conveyance device that holds and conveys a board on which components are mounted; a parts camera that irradiates a component held by the nozzle with light to image the component from below; and a controller that performs various control functions, is provided. The controller obtains a clearance height at which an obstacle between the parts camera and a predetermined mounting position on a board can be avoided, extracts from an HDD an imageable range of the component, and sets a target height of a lower surface of the component held by the nozzle when the nozzle passes above the parts camera, such that the target height is closest to the clearance height within the imageable range.
Public/Granted literature
- US20170156242A1 COMPONENT MOUNTING MACHINE Public/Granted day:2017-06-01
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