Invention Grant
- Patent Title: Dimension measuring apparatus and computer readable medium
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Application No.: US13789619Application Date: 2013-03-07
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Publication No.: US10317203B2Publication Date: 2019-06-11
- Inventor: Tsuyoshi Minakawa , Yasutaka Toyoda
- Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott, Will & Emery LLP
- Priority: JP2012-123886 20120531
- Main IPC: G01B21/20
- IPC: G01B21/20 ; G01N21/956

Abstract:
A dimension measuring apparatus for measuring a dimension between a first data contour which is an evaluation reference of a pattern to be evaluated and a second data contour which is the pattern to be evaluated generates first correspondence information between a point on the first data contour and a point on the second data contour, determines consistency of a correspondence included in the first correspondence information, corrects an inconsistent correspondence, and generates second correspondence information, when associating a point on the first contour data and a point on the second contour data with each other.
Public/Granted literature
- US20130325397A1 DIMENSION MEASURING APPARATUS AND COMPUTER READABLE MEDIUM Public/Granted day:2013-12-05
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