Invention Grant
- Patent Title: Substrate, color filter module, method for forming substrate module and display device
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Application No.: US15307880Application Date: 2016-01-20
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Publication No.: US10317586B2Publication Date: 2019-06-11
- Inventor: Tao Tang , Tao Luo , Qingde Long , Zhiyong Zhang , Xuejie Bai , Wen Xiao , Zerong Yang
- Applicant: BOE Technology Group Co., Ltd. , Chengdu BOE Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Beijing CN Chengdu
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Chengdu
- Agency: Westman, Champlin & Koehler, P.A.
- Priority: CN201510459538 20150730
- International Application: PCT/CN2016/071450 WO 20160120
- International Announcement: WO2017/016203 WO 20170202
- Main IPC: G02B3/08
- IPC: G02B3/08 ; G02B5/20 ; G02B3/00 ; G02B5/04 ; G03F7/00 ; H01L27/12 ; G02F1/1335 ; G02F1/1333

Abstract:
Embodiments of the present invention relates to a thin film transistor and a method for manufacturing the same, a display substrate and a display device. The thin film transistor comprises an active layer, a source electrode, a drain electrode and an ohmic contact layer, wherein the ohmic contact layer is disposed between the active layer and the source electrode and/or between the active layer and the drain electrode to improve an ohmic contact property of the active layer with the source electrode and/or the drain electrode. The present invention solves the problem of poor ohmic contact effect between the active layer and the source and drain electrodes in the existing thin film transistor, thereby improving the ohmic contact property of the active layer with the source and drain electrodes and meanwhile improving display effect of images of a display.
Public/Granted literature
- US20170153365A1 Substrate, Color Filter Module, Method for Forming Substrate Module and Display Device Public/Granted day:2017-06-01
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