Invention Grant
- Patent Title: Pattern matching method and apparatus
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Application No.: US13783333Application Date: 2013-03-03
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Publication No.: US10318805B2Publication Date: 2019-06-11
- Inventor: Hideki Nakayama , Masashi Sakamoto
- Applicant: Hitachi High-Technologies Corporation
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2012-099071 20120424
- Main IPC: H04N7/18
- IPC: H04N7/18 ; G06K9/00 ; G06T7/00 ; G06T7/33

Abstract:
When the degree of matching between patterns decreases due to a pattern fluctuation or an appearance fluctuation that has occurred during manufacturing steps, a heavy work burden would be placed on an operator. A data processing unit of a pattern matching apparatus calculates a threshold for determination of matching between a first template image and a partial region of a search target image obtained by capturing an image of the surface of a sample, on the basis of a result of evaluation of a similarity between the search target image and a second template image, the second template image having been captured in a wider range than the first template image.
Public/Granted literature
- US20130278748A1 PATTERN MATCHING METHOD AND APPARATUS Public/Granted day:2013-10-24
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