Invention Grant
- Patent Title: Conductive path
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Application No.: US15712930Application Date: 2017-09-22
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Publication No.: US10319495B2Publication Date: 2019-06-11
- Inventor: Ryo Kuroishi
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Yokkaichi, Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie
- Agency: Reising Ethington, P.C.
- Priority: JP2016-199857 20161011
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H01R4/02 ; B60R16/02 ; H01R12/63 ; H02G15/18 ; H01R4/72 ; H01R43/02 ; H01R43/28

Abstract:
A conductive path includes: a first conductor in which a terminal end portion serves as a first connection portion; a second conductor in which a second connection portion at a terminal end portion is coaxially fixed to the first connection portion; a support member that is more rigid than the first and second conductors, and is disposed so as to extend along a fixed portion between the first and second connection portions; and a heat-shrinkable tube (holding member) that integrates the support member with the first and second conductors while enveloping the support member. Even when an external force acts on the first and second conductors so as to skew the axes of the two conductors, the support member and the heat-shrinkable tube keep the two conductors in the coaxial state.
Public/Granted literature
- US20180102202A1 CONDUCTIVE PATH Public/Granted day:2018-04-12
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