Invention Grant
- Patent Title: High voltage high power energy storage devices, systems, and associated methods
-
Application No.: US14039617Application Date: 2013-09-27
-
Publication No.: US10319535B2Publication Date: 2019-06-11
- Inventor: Chen Zhaohui
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Thorpe North and Western, LLP
- Agent David W. Osborne
- Main IPC: H01G11/26
- IPC: H01G11/26 ; H01G11/30 ; H01G11/24 ; H01G11/86 ; H01G9/042 ; H01G11/04 ; H01G11/28 ; H01G11/46 ; H01G11/70 ; H01G11/68

Abstract:
A high power density energy storage device having enhanced operation voltage is provided. Such a device can include a cathode having a structured surface on a conductive substrate, an anode positioned adjacent to the cathode, where the anode includes a silicon substrate having a structured surface, and wherein the structured surface of the cathode is oriented toward the structured surface of the anode. The device can further include a dielectric material applied to the structured surface of the anode, a conductive material or a pseudocapacitive material applied to the structured surface of the cathode, and an electrolyte disposed between the cathode and the anode.
Public/Granted literature
- US20150092318A1 HIGH VOLTAGE HIGH POWER ENERGY STORAGE DEVICES, SYSTEMS, AND ASSOCIATED METHODS Public/Granted day:2015-04-02
Information query