Invention Grant
- Patent Title: Semiconductor device and electronic apparatus encapsulated in resin with embedded filler particles
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Application No.: US15258654Application Date: 2016-09-07
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Publication No.: US10319656B2Publication Date: 2019-06-11
- Inventor: Tomoyuki Furuhata
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-176505 20150908
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/528 ; H01L23/532

Abstract:
A semiconductor device includes a semiconductor substrate, an analog circuit block including an active element arranged in the semiconductor substrate, a metal layer having a slit or a plurality of metal interconnects arranged in parallel, positioned above the analog circuit block, and a resin layer containing a filler, positioned above at least the metal layer or the plurality of metal interconnects. In the case of forming a semiconductor device by sealing a semiconductor chip with resin having a filler mixed therein, according to this semiconductor device, it is possible to suppress lowering of the level of precision of the electric characteristics of the analog circuit, and a variation in the characteristics or a change in the characteristics, in a mold packaging process, without using special materials or production methods.
Public/Granted literature
- US20170069557A1 SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS USING THE SAME Public/Granted day:2017-03-09
Information query
IPC分类: