Invention Grant
- Patent Title: Circuit package having a plurality of epoxy mold compounds with different compositions
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Application No.: US15546846Application Date: 2015-03-27
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Publication No.: US10319657B2Publication Date: 2019-06-11
- Inventor: Chien-Hua Chen , Michael W Cumbie
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2015/023049 WO 20150327
- International Announcement: WO2016/159937 WO 20161006
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/00 ; H01L23/31 ; H01L21/56 ; B81B7/00 ; H01L23/373 ; H01L23/00
Abstract:
A circuit package panel containing a packaging of epoxy mold compounds and a circuit device in the packaging, wherein the packaging comprises, at least one hybrid layer of a first epoxy mold compound and a second epoxy mold compound of a different composition.
Public/Granted literature
- US20180025960A1 CIRCUIT PACKAGE Public/Granted day:2018-01-25
Information query
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