Invention Grant
- Patent Title: Multi-stacked package-on-package structures
-
Application No.: US15640882Application Date: 2017-07-03
-
Publication No.: US10319683B2Publication Date: 2019-06-11
- Inventor: Chen-Hua Yu , An-Jhih Su , Chi-Hsi Wu , Der-Chyang Yeh , Ming Shih Yeh , Wei-Cheng Wu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/538 ; H01L21/56 ; H01L25/16 ; H01L23/00 ; H01L21/768 ; H01L21/3105 ; H01L25/00 ; H01L21/683 ; H01L25/065

Abstract:
A multi-stacked package-on-package structure includes a method. The method includes: adhering a first die and a plurality of second dies to a substrate, the first die having a different function from each of the plurality of second dies; attaching a passive device over the first die; encapsulating the first die, the plurality of second dies, and the passive device; and forming a first redistribution structure over the passive device, the first die, and the plurality of second dies, the passive device connecting the first die to the first redistribution structure.
Public/Granted literature
- US20180226349A1 Multi-Stacked Package-on-Package Structures Public/Granted day:2018-08-09
Information query
IPC分类: