Invention Grant
- Patent Title: Chip package having die structures of different heights
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Application No.: US15784807Application Date: 2017-10-16
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Publication No.: US10319699B2Publication Date: 2019-06-11
- Inventor: Wen-Hsin Wei , Chi-Hsi Wu , Chen-Hua Yu , Hsien-Pin Hu , Shang-Yun Hou , Weiming Chris Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L25/00 ; H01L25/18 ; H01L23/498 ; H01L23/538 ; H01L25/065
Abstract:
Structures and formation methods of a chip package are provided. The chip package includes a chip stack including a number of semiconductor dies. The chip package also includes a semiconductor chip, and the semiconductor chip is higher than the chip stack. The chip package further includes a package layer covering a top and sidewalls of the chip stack and sidewalls of the semiconductor chip.
Public/Granted literature
- US20180040586A1 Chip Package Having Die Structures of Different Heights and Method of Forming Same Public/Granted day:2018-02-08
Information query
IPC分类:
