Invention Grant
- Patent Title: Integrated circuit structure having VFET and embedded memory structure and method of forming same
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Application No.: US15673548Application Date: 2017-08-10
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Publication No.: US10319731B2Publication Date: 2019-06-11
- Inventor: Ruilong Xie , Chun-Chen Yeh , Tenko Yamashita , Kangguo Cheng
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent Anthony Canale
- Main IPC: H01L27/11556
- IPC: H01L27/11556 ; H01L27/11526 ; H01L29/417 ; H01L29/66 ; H01L29/78 ; H01L21/8234 ; H01L29/423 ; H01L27/088 ; H01L29/788

Abstract:
The disclosure is directed to an integrated circuit structure and method of forming the same. The integrated circuit structure may include: a first device region including: a floating gate structure substantially surrounding a first fin that is over a substrate; a first bottom source/drain within the substrate, and beneath the first fin and the floating gate structure; a first top source/drain over the first fin and the floating gate structure; a first spacer substantially surrounding the first top source/drain and disposed over the floating gate structure; and a gate structure substantially surrounding and insulated from the floating gate structure, the gate structure being disposed over the substrate and having a height greater than a height of the floating gate.
Public/Granted literature
- US20190051659A1 INTEGRATED CIRCUIT STRUCTURE HAVING VFET AND EMBEDDED MEMORY STRUCTURE AND METHOD OF FORMING SAME Public/Granted day:2019-02-14
Information query
IPC分类: