Invention Grant
- Patent Title: Three dimensional semiconductor memory devices
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Application No.: US15844188Application Date: 2017-12-15
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Publication No.: US10319738B2Publication Date: 2019-06-11
- Inventor: Chang-Bum Kim , Sunghoon Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2017-0044144 20170405
- Main IPC: G11C16/04
- IPC: G11C16/04 ; G11C16/08 ; G11C5/06 ; H01L27/11582 ; G11C16/10 ; H01L27/1157 ; H01L27/11575 ; H01L27/02 ; G11C8/08 ; G11C8/14 ; G11C8/10 ; G11C5/02

Abstract:
A three-dimensional semiconductor memory device includes a cell string vertically extending from a top surface of a substrate and having first and second cell transistors, first and second word lines connected to gate electrodes of the first and second cell transistors respectively, a first pass transistor connecting the first word line to a row decoder, and a second pass transistor connecting the second word line to the row decoder. The first pass transistor includes a plurality of first sub-transistors connected in parallel between the first word line and the row decoder.
Public/Granted literature
- US20180294277A1 THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES Public/Granted day:2018-10-11
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