Invention Grant
- Patent Title: FinFET device and method of forming same
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Application No.: US15726074Application Date: 2017-10-05
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Publication No.: US10319832B2Publication Date: 2019-06-11
- Inventor: Chung-Ting Li , Bi-Fen Wu , Jen-Hsiang Lu , Chih-Hao Chang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/28 ; H01L29/06 ; H01L21/8234 ; H01L29/78 ; H01L27/088 ; H01L29/417

Abstract:
A method includes forming a fin extending above an isolation region. A sacrificial gate stack having a first sidewall and a second sidewall opposite the first sidewall is formed over the fin. A first spacer is formed on the first sidewall of the sacrificial gate stack. A second spacer is formed on the second sidewall of the sacrificial gate stack. A patterned mask having an opening therein is formed over the sacrificial gate stack, the first spacer and the second spacer. The patterned mask extends along a top surface and a sidewall of the first spacer. The second spacer is exposed through the opening in the patterned mask. The fin is patterned using the patterned mask, the sacrificial gate stack, the first spacer and the second spacer as a combined mask to form a recess in the fin. A source/drain region is epitaxially grown in the recess.
Public/Granted literature
- US20180315831A1 FINFET DEVICE AND METHOD OF FORMING SAME Public/Granted day:2018-11-01
Information query
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