Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15446642Application Date: 2017-03-01
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Publication No.: US10319844B2Publication Date: 2019-06-11
- Inventor: Mitsuhiko Kitagawa
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2016-182065 20160916
- Main IPC: H01L21/74
- IPC: H01L21/74 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/36 ; H01L29/40 ; H01L29/66 ; H01L29/78 ; H01L29/94 ; H01L29/739

Abstract:
A semiconductor device includes a first electrode, a first semiconductor region disposed on and electrically connected to the first electrode, a second semiconductor region disposed on the first semiconductor region and having a carrier concentration lower than that of the first semiconductor region, a third semiconductor region disposed on the second semiconductor region, a fourth semiconductor region disposed on the third semiconductor region, a fifth semiconductor region disposed on the second semiconductor region and separated from the third semiconductor region in a direction, a gate electrode disposed on the second semiconductor region, facing the third semiconductor region via an insulating layer in the direction and positioned between the third and fourth semiconductor regions, a second electrode disposed on and electrically connected to the fourth semiconductor region, and a third electrode disposed on the fifth semiconductor region, separated from the second electrode, and electrically connected to the fifth semiconductor region.
Public/Granted literature
- US20180083129A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-03-22
Information query
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