Invention Grant
- Patent Title: Semiconductor devices and methods of fabricating the same
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Application No.: US15844863Application Date: 2017-12-18
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Publication No.: US10319859B2Publication Date: 2019-06-11
- Inventor: Sujin Jung , JinBum Kim , Kang Hun Moon , Kwan Heum Lee , Byeongchan Lee , Choeun Lee , Yang Xu
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2015-0073121 20150526
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/78 ; H01L29/08 ; H01L29/66 ; H01L21/8234

Abstract:
A semiconductor device is disclosed. The device includes a substrate including an active region defined by a device isolation layer, a fin pattern protruding from the substrate and extending in a first direction, the fin pattern including a gate fin region and a source/drain fin region, a gate pattern disposed on the gate fin region to extend in a second direction crossing the first direction, and a source/drain portion provided on a sidewall of the source/drain fin region. When measured in the second direction, a width of the source/drain fin region is different from a width in the second direction of the gate fin region.
Public/Granted literature
- US20180108779A1 SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME Public/Granted day:2018-04-19
Information query
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