Invention Grant
- Patent Title: Semiconductor light-emitting device and method for manufacturing the same
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Application No.: US15643136Application Date: 2017-07-06
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Publication No.: US10319887B2Publication Date: 2019-06-11
- Inventor: Masahiko Kobayakawa , Tomoichiro Toyama
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2016-138140 20160713
- Main IPC: H01L33/52
- IPC: H01L33/52 ; H01L33/54 ; H01L33/00 ; H01L33/62

Abstract:
A semiconductor light-emitting device includes a base, a light-emitting element and a sealing resin. The base includes an obverse surface and a reverse surface spaced in a first direction, first side surfaces spaced in a second direction crossing the first direction, and second side surfaces spaced in a third direction crossing the first and second directions. The light-emitting element is on the base obverse surface. The sealing resin for covering the light-emitting element is smaller than the base in plan. The base has a wiring pattern connected to the light-emitting element and including an obverse surface electrode on the base obverse surface. The base also has a resist layer including a pattern-covering portion overlapping with the obverse surface electrode. The pattern-covering portion includes a resin outflow preventing portion, disposed outside the sealing resin in plan and extends continuously from one second side surface to the other.
Public/Granted literature
- US20180019383A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-01-18
Information query
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