Invention Grant
- Patent Title: Ultrasonic sensor and manufacturing method for the same
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Application No.: US15078098Application Date: 2016-03-23
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Publication No.: US10319897B2Publication Date: 2019-06-11
- Inventor: Koji Ohashi
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2015-063324 20150325
- Main IPC: H01L41/113
- IPC: H01L41/113 ; B06B1/06 ; H01L41/08 ; H01L41/314 ; H01L41/33

Abstract:
An ultrasonic sensor includes: when two orthogonal axes are referred to as an X axis and a Y axis and a plane formed by the X axis and the Y axis is referred to as an XY plane, a substrate disposed across the XY plane; a plurality of spaces formed in the substrate in at least one direction of an X-axis direction and a Y-axis direction; a vibrating plate that is provided on the substrate such that the spaces are closed and that has a first surface on the substrate side and a second surface facing the first surface; and a piezoelectric element that is provided at a portion on the second surface side of the vibrating plate that corresponds to the space, and that transmits/receives an ultrasonic wave. At least some of the spaces are arranged to form a zigzag shape.
Public/Granted literature
- US20160284973A1 ULTRASONIC SENSOR AND MANUFACTURING METHOD FOR THE SAME Public/Granted day:2016-09-29
Information query
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