Invention Grant
- Patent Title: Portable electronic device and back cover assembly thereof
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Application No.: US15628721Application Date: 2017-06-21
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Publication No.: US10320058B2Publication Date: 2019-06-11
- Inventor: Po-Kai Hsu , Chih-Ming Su
- Applicant: INPAQ TECHNOLOGY CO., LTD.
- Applicant Address: TW Miaoli County
- Assignee: INPAQ TECHNOLOGY CO., LTD.
- Current Assignee: INPAQ TECHNOLOGY CO., LTD.
- Current Assignee Address: TW Miaoli County
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: TW106110516A 20170329
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/38 ; H04B5/00 ; H01Q1/22 ; A45C11/00 ; H04B1/3888

Abstract:
The present disclosure provides a portable electronic device and a back cover assembly thereof. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.
Public/Granted literature
- US20180287245A1 PORTABLE ELECTRONIC DEVICE AND BACK COVER ASSEMBLY THEREOF Public/Granted day:2018-10-04
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