For an electrical component socket including a socket base having a frame shape to which a contact module is to be inserted and attached from below, an embodiment has an objective to allow contact pins to be in contact with a circuit board with stability. The electrical component socket is configured such that the upper-side plate is caused to ascend to an uppermost position by elastic force of urging means in a state where the contact module is not attached to the socket base. In a state where the contact module is attached to the socket base and disposed on the circuit board, the upper-side plate moves down toward a lower-side plate side against elastic force of the contact pins to be positioned at a predetermined base position, so that lower-side contact portions of the contact pins are brought into contact with the circuit board at a predetermined contact pressure.