Invention Grant
- Patent Title: Apparel compute device connection
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Application No.: US15810910Application Date: 2017-11-13
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Publication No.: US10320117B2Publication Date: 2019-06-11
- Inventor: Glen Eric Lewallen
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01R13/62
- IPC: H01R13/62 ; A41D1/00 ; H01R12/79

Abstract:
System and techniques for an apparel compute device connection are described herein. A base for a removable apparel compute device is bonded to a garment. The base includes connector portions to interface between the apparel compute device and traces within the garment electrically. The apparel compute device is secured to the base via a magnet and oriented via a physical arrangement of the connector portions.
Public/Granted literature
- US20180294601A1 APPAREL COMPUTE DEVICE CONNECTION Public/Granted day:2018-10-11
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