Invention Grant
- Patent Title: Solder sealing in high-power laser devices
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Application No.: US15807824Application Date: 2017-11-09
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Publication No.: US10320145B2Publication Date: 2019-06-11
- Inventor: Parviz Tayebati , Michael Deutsch
- Applicant: Parviz Tayebati , Michael Deutsch
- Applicant Address: US MA Wilmington
- Assignee: TERADIODE, INC.
- Current Assignee: TERADIODE, INC.
- Current Assignee Address: US MA Wilmington
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01S3/04
- IPC: H01S3/04 ; H01S5/022 ; H01S5/40 ; H01S3/08 ; H01S5/14 ; H01S5/02 ; H01S5/024
Abstract:
In various embodiments, laser apparatuses include thermal bonding layers between various components and sealing materials for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.
Public/Granted literature
- US20180069377A1 SOLDER SEALING IN HIGH-POWER LASER DEVICES Public/Granted day:2018-03-08
Information query
