Invention Grant
- Patent Title: Electrical connection structure
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Application No.: US16084417Application Date: 2017-02-15
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Publication No.: US10320170B2Publication Date: 2019-06-11
- Inventor: Anri Hara , Akira Inoue
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Seed IP Law Group LLP
- Priority: JP2016-064521 20160328; JP2016-064524 20160328
- International Application: PCT/JP2017/005492 WO 20170215
- International Announcement: WO2017/169228 WO 20171005
- Main IPC: B60R16/023
- IPC: B60R16/023 ; H02G3/08 ; H02G3/16 ; B60R16/02

Abstract:
An electrical connection structure includes a partition member provided with an opening, a casing, a plurality of connection members, and a mold. The partition member divides an inside of the casing into a first space and a second space. The plurality of connection members electrically connect a first electric circuit accommodated in the first space to a second electric circuit accommodated in the second space. The mold blocks the opening which penetrates the partition member. The partition member includes a first surface facing the first space, and a second surface that is reverse to the first surface and faces the second space. The plurality of connection members extend from the second space to the first space via the mold. A periphery of the surface of the mold that faces the second surface is in close contact with the second surface via a waterproof sealing member.
Public/Granted literature
- US20190074677A1 ELECTRICAL CONNECTION STRUCTURE Public/Granted day:2019-03-07
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