Invention Grant
- Patent Title: Method of manufacturing elastic wave device
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Application No.: US14705029Application Date: 2015-05-06
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Publication No.: US10320355B2Publication Date: 2019-06-11
- Inventor: Mitsuyoshi Hira , Seiji Kai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-266376 20121205
- Main IPC: H03H3/02
- IPC: H03H3/02 ; H01L41/047 ; H01L41/338 ; H01L41/331 ; H03H3/08 ; H03H9/10 ; H03H3/04 ; H01L41/23

Abstract:
Functional element units and a connection line electrically connecting the functional element units are formed on one principal surface of a piezoelectric motherboard. A resin support layer enclosing the functional element units is formed on the one principal surface of the motherboard. An elastic wave device with the functional units is obtained by dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line. The connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected. Prior to dividing the multilayer body, a retaining member made of resin which straddles the line main body in the width direction of the line main body is formed separate from the support layer on the motherboard.
Public/Granted literature
- US20150236237A1 ELASTIC WAVE DEVICE MANUFACTURING METHOD AND ELASTIC WAVE DEVICE Public/Granted day:2015-08-20
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