Invention Grant
- Patent Title: Circuitry and method for readout of hybrid bonded image sensors
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Application No.: US15979366Application Date: 2018-05-14
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Publication No.: US10321078B2Publication Date: 2019-06-11
- Inventor: Song Xue
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop Gage LLP
- Main IPC: H04N5/374
- IPC: H04N5/374 ; H04N5/357 ; H04N5/243 ; H04N5/3745 ; H01L27/146 ; H04N5/369

Abstract:
A hybrid bonded image sensor has a photodiode die with macrocells having at least one photodiode and a bond contact; a supporting circuitry die with multiple supercells, each supercell having at least one macrocell unit bonded to the bond contact of a macrocell of the photodiode die. Each macrocell unit has a reset transistor adapted to reset photodiodes of the photodiode die macrocell. Each supercell has a differential amplifier configurable to receive a noninverting input from a photodiode and an inverting input, the differential amplifier providing an output, each differential amplifier has an amplifier reset transistor coupled to the differential amplifier output and the inverting input; a first capacitor coupled between the differential amplifier output and the inverting input, and a second capacitor coupled between the inverting input and a signal ground. The first and second capacitor of embodiments has controllable capacitance to adjust gain.
Public/Granted literature
- US20180262704A1 CIRCUITRY AND METHOD FOR READOUT OF HYBRID BONDED IMAGE SENSORS Public/Granted day:2018-09-13
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