Invention Grant
- Patent Title: Composite electronic component and board having the same
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Application No.: US15295502Application Date: 2016-10-17
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Publication No.: US10321571B2Publication Date: 2019-06-11
- Inventor: Yu Jin Choi , Soo Hwan Son , Min Kyoung Cheon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan Lewis & Bockius LLP
- Priority: KR10-2016-0000540 20160104
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01G4/008 ; H01G4/228 ; H01G4/38 ; H01G4/224 ; H01G4/30 ; H01G9/042 ; H01G9/08 ; H01G15/00 ; H05K1/11 ; H01G4/40 ; H01G9/012 ; H01G9/15 ; H01G2/06

Abstract:
A composite electronic component includes a multilayer capacitor including external electrodes, a tantalum capacitor disposed adjacently to the multilayer capacitor, first electrode parts connected to the external electrodes, a second electrode part connected to a second body, and an encapsulant encapsulating the multilayer capacitor and the tantalum capacitor and formed such that portions of the first and second electrode parts are exposed.
Public/Granted literature
- US20170196092A1 COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2017-07-06
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