Invention Grant
- Patent Title: Solder resist and printed wiring board
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Application No.: US15657510Application Date: 2017-07-24
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Publication No.: US10321579B2Publication Date: 2019-06-11
- Inventor: Yuji Ikawa
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2016-144131 20160722
- Main IPC: H05K3/34
- IPC: H05K3/34 ; H05K3/24 ; H05K3/28 ; H05K3/46

Abstract:
A solder resist includes a lower layer including a first resin and particles, and an upper layer including a second resin and formed on the lower layer. The particles are one kind selected from a group of inorganic particles, and the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles.
Public/Granted literature
- US20180027664A1 SOLDER RESIST AND PRINTED WIRING BOARD Public/Granted day:2018-01-25
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